The paper provides a comparative analysis of additive technologies in the field of formation of electromechanical designs of functional devices. In particular, the problem of using additive technologies, their relevance in relation to modern needs in different fields of science and technology is put, the essence of additive technological processes for the production of various kinds of products is revealed and a specific design and technological approach for creating a modular product on the basis of these technologies is defined.

Keywords: additive technologies, printed circuit board, 3D printing, fused deposition modeling , selective laser sintering, stereolithography, digital light processing, direct metal laser sintering, selective laser melting, direct ink writing

This paper describes the results of modeling thermal processes and air flows occurring in a universal power source (UPS) with a digital control system for output parameters under given operating conditions. The UIP is intended for scientific research in the field of electrochemical copper deposition in order to form through and via holes in printed circuit boards, three-dimensional microassemblies, metallization of epoxy resins, and organic materials. The article discusses the features of the development of a universal power source, presents the key results of the design and study of the thermodynamic characteristics of a prototype sample.

Keywords: universal power supply, microcontroller, computer aided design, printed circuit board, efficiency factor, computational fluid dynamics, mechanical computer aided design, electrical computer aided design, design rule checking, finite element method

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