Development of a heat-insulating polymer coating filled with phenol-formaldehyde microspheres
Abstract
Development of a heat-insulating polymer coating filled with phenol-formaldehyde microspheres
Incoming article date: 25.05.2020This paper presents the results of the development of a heat-insulating coating based on a polymer binder for thermal insulation of hot metal surfaces of industrial equipment, process plants, pipeline surfaces, operating at temperatures up to 100 0C. The heat-insulating coating is based on a polymer composition containing a mixture of acrylic polymer and styrene-butadiene rubber, hollow phenol-formaldehyde microspheres, pigment and water as a binder. The use of phenol-formaldehyde hollow microspheres in this composition in an amount of 20.0 to 40.0 wt. % as a filler, it allows to reduce the thermal conductivity of the developed coating and increase its strength characteristics, in comparison with a similar coating containing carbon microspheres. The use of this composition allows to obtain a polymer coating with high thermal insulation and mechanical properties.
Keywords: heat-insulating coating, acrylic polymer, styrene-butadiene rubber, hollow phenol-formaldehyde microspheres, tensile strength, thermal conductivity